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PSoC 4XX7藍(lán)牙低功耗(BLE)開發(fā)方案 |
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文章來源: 更新時間:2014/11/26 11:37:00 |
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Cypress公司的PSoC 4XX7系列是可擴(kuò)展和可重配置的平臺架構(gòu),是一個包含ARM® Cortex™-M0 CPU 的可編程嵌入式系統(tǒng)控制器,包括集成低功耗藍(lán)牙(BLE)的微控制器, 無線模塊和子系統(tǒng)以及數(shù)字可編程邏輯,高性能的模數(shù)轉(zhuǎn)換(ADC),比較器模式的運(yùn)算放大器以及標(biāo)準(zhǔn)通信和時序外設(shè).本文介紹了PSoC 4XX7_BLE主要特性,框圖, BLE系列系統(tǒng)應(yīng)用連接圖以及CY8CKIT-042-BLE 藍(lán)牙低功耗Pioneer開發(fā)套件主要特性,電路圖和材料清單,PCB設(shè)計文件.
PSoC® 4 是一個可擴(kuò)展和可重配置的平臺架構(gòu),是一個包含ARM® Cortex™-M0 CPU 的可編程嵌入式系統(tǒng)控制器。它把可編程、可重新配置的模擬和數(shù)字模塊與靈活的自動布線資源相結(jié)合;谠撈脚_的PSoC 4XX7_BLE 系列產(chǎn)品集成了下面各成分:集成低功耗藍(lán)牙(簡稱BLE,還稱為Bluetooth Smart)的微控制器、無線模塊和子系統(tǒng)。其他功能包括數(shù)字可編程邏輯、高性能的模數(shù)轉(zhuǎn)換(ADC) 、比較器模式的運(yùn)算放大器以及標(biāo)準(zhǔn)通信和時序外設(shè)。為了滿足新應(yīng)用和設(shè)計的要求, PSoC 4XX7_BLE 產(chǎn)品完全能夠與PSoC 4 平臺系列產(chǎn)品向上兼容。可編程模擬和數(shù)字子系統(tǒng)支持在運(yùn)行環(huán)境下調(diào)整的靈活設(shè)計。
PSoC 4XX7_BLE主要特性:
32 位MCU 子系統(tǒng)
■ 帶有單周期乘法的48 MHz ARM Cortex-M0 CPU
■ 包含讀取加速器的閃存可達(dá)128 KB
■ SRAM 容量高達(dá)16 KB
BLE 無線和子系統(tǒng)
■ 具有驅(qū)動50 Ω 天線功能的2.4 GHz RF 接收器
■ 數(shù)字PHY
■ 鏈路層引擎支持主設(shè)備模式和從設(shè)備模式
■ RF 輸出功率范圍:–18 dBm ~ +3 dBm
■ RX 靈敏度:–92 dBm
■ RX 電流:18.7 mA
■ 在0 dBm 時, TX 電流為16.5 mA
■ RSSI:1 dB 分辨率
可編程的模擬模塊
■ 四個運(yùn)算放大器包括可重新配置的高驅(qū)動外部/ 高帶寬內(nèi)部驅(qū)動器、比較器模式和ADC 輸入緩存功能。能夠在深度睡眠模式下運(yùn)行。
■ 12 位分辨率、1 Msps 采樣率的SAR ADC 包括差分模式、單端模式和具有信號求平均功能的通道序列發(fā)生器。
■ 每個引腳上的兩個電流DAC (IDAC)用于通用目的或電容式感應(yīng)應(yīng)用場合
■ 在深度睡眠模式下操作的兩個低功耗比較器可編程的數(shù)字模塊
■ 四個可編程的邏輯模塊(又稱通用數(shù)字模塊UDB),每個模塊包含8 個宏單元和數(shù)據(jù)路徑
■ 塞普拉斯提供了外設(shè)組件庫、用戶定義的狀態(tài)機(jī)以及Verilog 輸入
電源管理
■ 活動模式:3 MHz 的閃存執(zhí)行程序中,電流為1.7 mA
■ 深度睡眠模式:在WCO 打開時,電流為1.3 μA
■ 休眠模式:在RAM 保留數(shù)
電容式感應(yīng)
■ 賽普拉斯的電容式Sigma-Delta 觸摸感應(yīng)(CSD)提供了一流的信噪比(SNR > 5:1)和耐水性
■ 通過賽普拉斯提供的軟件組件可以更容易地實現(xiàn)電容式感應(yīng)設(shè)計
■ 硬件智能調(diào)校算法(SmartSense™)
段式LCD 驅(qū)動
■ 所有引腳上都支持LCD 驅(qū)動(Com 或Seg 驅(qū)動)
■ 能夠在深度睡眠模式下運(yùn)行,每個引腳擁有4 位存儲器
串行通信
■ 兩個運(yùn)行獨(dú)立且可重新配置的串行通信模塊(SCB)包含可重新配置I2C、SPI 或UART 功能時序和脈沖寬度調(diào)制
■ 四個16 位定時器/ 計數(shù)器脈沖寬度調(diào)制器(TCPWM)模塊
■ 中心對齊模式、邊緣模式和偽隨機(jī)模式
■ 基于比較器觸發(fā)的停止(Kill)信號可用于電機(jī)驅(qū)動以及其它可靠性較高的數(shù)字邏輯應(yīng)用
多達(dá)36 個可編程的GPIO
■ 56 引腳7 mm × 7 mm QFN 封裝
■ 3.51 mm × 3.91 mm 的68 引腳球形焊盤CSP 封裝
■ 任何GPIO 引腳可用作CapSense、LCD、模擬或數(shù)字引腳功能
■ 兩個過壓容限(Overvoltage-tolerant, OVT)引腳符合I2C 接口規(guī)范;驅(qū)動模式、驅(qū)動強(qiáng)度和轉(zhuǎn)換速率均是可編程的
PSoC Creator™ 設(shè)計環(huán)境
■ 集成開發(fā)環(huán)境(IDE)提供了原理圖設(shè)計輸入和編譯(包括模擬和數(shù)字自動布線)
■ 用于所有固定功能外設(shè)和可編程外設(shè)的API 組件行業(yè)標(biāo)準(zhǔn)軟件的兼容性
■ 輸入原理圖后,可以使用基于ARM 的行業(yè)標(biāo)準(zhǔn)開發(fā)工具進(jìn)行開發(fā)
![](http://solution.eccn.com/uploads/solution/201411/20141125110112647.gif)
圖1. PSoC 4XX7_BLE系列框圖
![](http://solution.eccn.com/uploads/solution/201411/2014112511011298.gif)
圖2. PSoC 4XX7_BLE系列系統(tǒng)應(yīng)用連接圖
CY8CKIT-042-BLE 藍(lán)牙低功耗Pioneer開發(fā)套件
The CY8CKIT-042-BLE Bluetooth Low Energy (BLE) Pioneer Kit is intended for use as a development platform for hardware or software in a laboratory environment. The board is an open system design, which does not include a shielded enclosure. For this reason, the board may cause interference with other electrical or electronic devices in close proximity. In a domestic environment, this product may cause radio interference. In such cases, the user may be required to take adequate preventive measures. Also, this board should not be used near any medical equipment or RF devices.
The CY8CKIT-042-BLE Bluetooth Low Energy (BLE) Pioneer Kit is intended for use as a development, demonstration and evaluation platform for hardware or software in a laboratory environment. The kit is not intended for general consumer use. It generates, uses and can radiate radio frequency energy. It has not been tested for compliance with the limits applicable under any standard. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. Cypress recommends that the kit only be used in a shielded room.
Thank you for your interest in the CY8CKIT-042-BLE Bluetooth® Low Energy (BLE) Pioneer Kit. This kit is designed to showcase the functionality and ease of use of PSoC® 4 BLE and PRoC™ BLE devices while developing Bluetooth Low Energy (Bluetooth Smart) applications. Cypress’s BLE solution provides an easy-to-use, intuitive GUI to configure the BLE protocol stack using a BLE component available in the Cypress standard integrated development environment (IDE), PSoC Creator.
The CySmart PC tool allows emulation of a central device and quick access to peripheral connections and debugging. The solution provides a true single-chip solution with an integrated balun, Cypress’s industry-leading capacitive sensing technology, an analog front end (AFE) for biometric sensors, and digital peripherals suited to a wide variety of applications. Designed for flexibility, this kit offers footprint compatibility with several third-party Arduino™ shields. The kit includes a provision to populate an extra header to support Digilent® Pmod™ peripheral modules. In addition, the board features a CapSense® slider, an RGB LED, a push-button switch, an integrated USB programmer, a program and debug header, an F-RAM, and USB-UART/I2C bridges.
Pioneer開發(fā)套件包括:
■ BLE Pioneer Baseboard preloaded with the CY8CKIT-142 PSoC 4 BLE Module
■ CY5671 PRoC BLE Module
■ CY5670 CySmart USB Dongle
■ Quick start guide
■ USB standard A to mini-B cable
■ Four jumper wires (4 inch) and two proximity sensor wires (5 inch)
■ Coin cell
![](http://solution.eccn.com/uploads/solution/201411/20141125110112183.gif)
圖2. Pioneer開發(fā)套件外形圖
Pioneer開發(fā)套件基板詳情:
The BLE Pioneer Baseboard consists of the blocks shown in Figure3.
1. RGB LED
2. BLE module reset button
3. CapSense proximity header
4. User button
5. CapSense slider
6. LDO 1.9 V~5 V
7. Arduino compatible I/O header (J2)
8. Arduino compatible power header (J1)
9. Digilent Pmod compatible I/O header (J5)
10.Cypress F-RAM 1 Mb (FM24V10-G)
11.PSoC 5LP I/O header (J8)
12.PSoC 5LP - programmer and debugger (CY8C5868LTI-LP039)
13.Coin cell holder (bottom side)
14.USB connector (J13)
15.Power LED
16.Status LED
17.System power supply jumper (J16)
18.Arduino compatible I/O header (J3)
19.Arduino compatible I/O header (J4)
20.BLE power supply jumper (J15)
21.BLE module headers (J10/J11)
![](http://solution.eccn.com/uploads/solution/201411/20141125110112810.gif)
圖3. Pioneer開發(fā)板外形圖
![](http://solution.eccn.com/uploads/solution/201411/20141125110113564.gif)
圖4. Pioneer開發(fā)板電路圖(1)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113902.gif)
圖5. Pioneer開發(fā)板電路圖(2)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113443.gif)
圖6. Pioneer開發(fā)板電路圖(3)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113478.gif)
圖7. Pioneer開發(fā)板電路圖(4)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113316.gif)
圖8. Pioneer開發(fā)板電路圖(5)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113611.gif)
圖9. Pioneer開發(fā)套件BLE模塊外形圖
![](http://solution.eccn.com/uploads/solution/201411/20141125110113272.gif)
圖10. Pioneer開發(fā)套件BLE模塊電路圖
![](http://solution.eccn.com/uploads/solution/201411/2014112511011396.gif)
圖11. Pioneer開發(fā)套件BLE Dongle外形圖
![](http://solution.eccn.com/uploads/solution/201411/20141125110113745.gif)
圖12. Pioneer開發(fā)套件BLE Dongle電路圖(1)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113193.gif)
圖13. Pioneer開發(fā)套件BLE Dongle電路圖(2)
Pioneer開發(fā)套件BLE Pioneer板材料清單:
![](http://solution.eccn.com/uploads/solution/201411/20141125110113263.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113384.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113196.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113117.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110113509.gif)
CY5671 PRoC BLE模塊材料清單:
![](http://solution.eccn.com/uploads/solution/201411/20141125110114560.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110114511.gif)
CY8CKIT-142 PRoC 4 BLE模塊材料清單:
![](http://solution.eccn.com/uploads/solution/201411/20141125110114351.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110114605.gif)
Dongle材料清單:
![](http://solution.eccn.com/uploads/solution/201411/20141125110114344.gif)
![](http://solution.eccn.com/uploads/solution/201411/2014112511011436.gif)
![](http://solution.eccn.com/uploads/solution/201411/20141125110114365.gif) |
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